3D Heterogeneous Integration Design Enablement Engineer (2026 New College Graduate)
Apply on Globalfoundries’s site →About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com . Summary of Role: GlobalFoundries Fab8 is seeking a motivated R&D design enablement engineer to become part of our state-of-the-art 300mm fabrication facility in Malta, New York . This role will entail 3D heterogeneous integration (3DHI) design enablement to enable our next-generation advanced packaging R&D efforts, which include wafer - to - wafer bonding, die - to - wafer bonding , TSV/TOV and interposer development. Essential Responsibilities: P ublish D esign M anual (DM) specifications based on failure modes identified for packaging required by the product lines in partnership with the unit process and R&D engineers. DM is a collection of all technology restrictions (geometry rules, electrical rules, etc.) that must be followed for an integrated circuit (IC) design to be manufacturable. Advanced packaging liaison to the DM and PDK ( Process D esign K it) teams to translate packaging requirements to a device enabl e ment specification covering: design rules , library device ( TSV) layouts, layout vs schematic( LVS) requirements , device model terminals.