CMP/Bond Process Engineer

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Support CMP or Bond Process developments/improvements as well as technology transfer on DRAM in R&D at initial stages and carry on subsequently in the manufacturing environment. • Identify and evaluate interactions between equipment, modules and processes and resolve related issues. • Resolve yield and reliability issues through process development. • Stay engaged with vendors on strategic process/hardware evaluations. • Work closely with manufacturing Fab and understand manufacturing issues. • Work closely with PI groups to understand implications of inline/probe/parametric data and identify opportunities for process improvement. • Design multi-level SWRs using DOE concept and develop framework for process changes and conversion. • Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions – effective interaction with manufacturing on such areas. • Incorporate best known manufacturing methods into early development phase of upcoming nodes. • Provide technical documentation for new technology transfer. • Interact positively with the group, pilot line, vendors, integration, manufacturing, management, to contribute to key improvement projects.