Defect Characterization Low Yield Analysis Engineer
Apply on Intel’s site →Job Details: Job Description: As a Low Yield Analysis (LYA) Engineer within Intel Foundry's Defect Characterization organization, you will drive root cause identification and yield improvement strategies for advanced packaging assembly and substrate technology development programs. You will lead complex technical investigations, develop innovative characterization methodologies, and collaborate across manufacturing, quality, process integration, design, and module technology development organizations to resolve critical yield challenges. This role requires a strong sense of ownership, urgency, technical leadership, and customer focus. The successful candidate will independently drive investigations, influence technical decisions, mentor team members, and deliver measurable business impact through yield improvement and defect characterization excellence. Responsibilities Lead end-to-end investigations to identify and resolve complex yield, defect, and quality issues. Serve as a technical owner for major factory, platform, or technology development programs. Define characterization strategies, learning plans, and root cause methodologies for critical technical challenges. Utilize advanced analytical techniques including Optical Microscopy, SEM/EDS, EBSD, CSAM, FTIR, Raman, FIB, ion milling, and mechanical cross-sectioning to identify failure mechanisms. Correlate characterization results with electrical data, defect inspection data, process history, and manufacturing information to establish root cause.