Director, Process Engineer – Dry Etch

Job Details: Job Description: Intel is transforming from an Integrated Device Manufacturer (IDM) to a leading foundry service provider, offering world-class manufacturing capabilities to customers worldwide. Our Manufacturing Development and Customer Engineering (MDCE) organization is at the forefront of this transformation, focusing on yield improvement, performance optimization, and exceptional customer service delivery. We are responsible for improving process capability for Intel's technology nodes from initial product qualification to high volume manufacturing. We are seeking a Director, Process Engineer – Dry Etch to join our our team within MDCE. This role leads dry etch process engineering efforts to drive technology development, process capability, and manufacturability across advanced CMOS technologies. This role will be responsible for development, optimization, and sustaining of dry etch processes across modules that may include plasma etch, reactive ion etch (RIE), atomic layer etch (ALE), conductor etch, dielectric etch, thermal etch, and related post-etch treatment or clean processes. Key Responsibilities: Primary responsibilities will reside at the intersection of technology development and High-Volume Manufacturing (HVM), especially on new or transferred dry etch processes that require engineering to meet high volume requirements. This includes driving safety, quality, performance, throughput, process capability, profile control, critical dimension uniformity, selectivity, lower defectivity, improved yield, and lower cost.