Intern - SSD Process Engineer
Apply on Micron’s site →Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Project Title Selective Solder Tooling Enhancement and BOL Conversion Readiness Enhancement Description Enhance selective solder process robustness by introducing tooling improvements while strengthening BOL conversion readiness by introducing a standardized tooling selection system covering Cornerfill (CF), Selective Solder (SS) and Enclosure Assembly (EA). The project aims to reduce conversion ambiguity, setup errors and process variability across BOL operations. Scope 1. Selective Solder Tooling Enhancement (SS) - Qualify and release selective solder process enhancement toolings to improve setup stability, consistency and repeatability - Address tooling‑related contributors to process variation during selective solder operations 2. BOL Conversion Readiness Enhancement (CF, SS, EA) - Develop and implement a tooling selection system defining required toolings for each product conversion across BOL - Standardize tooling requirements to eliminate ambiguity during CF, SS and EA conversions - Improve conversion clarity, reduce human dependency and minimize conversion‑related errors Deliverables 1.