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Module Development Engineer - LTD Dry Etch

IntelUS, Oregon, Hillsboro$133,800+Process & Fab
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The published floor of $133,800 is 8% above the Process & Fab median of $124,000. First seen on this site 2026-09-22, open 4 days.
Posted 2026-09-11 · read from workday

Job Details: Job Description: Business Group Intel Foundry Technology Development is committed to delivering world-class manufacturing solutions that power Intel's product roadmap. The team leads advancements in semiconductor process engineering, enabling innovative device architectures and high-volume production. Joining this team means contributing to Intel's pursuit of excellence and maintaining its leadership in a dynamic, competitive market. About the Role Join Intel Logic Technology Development and help advance the next generation of patterning. You will operate in a high impact space, partnering closely with cross functional teams (Process Integration, Manufacturing, Equipment Engineering, Yield/Defect Engineering, and suppliers) to solve complex technical challenges and establish long term systems that sustain performance. This role requires regular onsite presence to fulfill essential job responsibilities. Drive technology development for future technology and high-volume manufacturing, provide process integration and equipment solutions, and perform feasibility studies to meet desired device specifications. Own and drive development of the next generation patterning processes, including process architecture, optimization strategies, and qualification methodologies. Perform pathfinding activities in support of process and hardware development on existing and first of kind equipment, enabling manufacturing of innovative device architectures and developing roadmaps for technologies enabling future roadmap.