MST – Etch

Job Responsibility: Job Summary: Daily tasks will include rebuilding and cleaning subassemblies for semiconductor manufacturing equipment. Performing Preventative Maintenance (PM) tasks Following and continuous improvement of WSS Documents Completed Post Maintenance Qualifications and checks Support of subfab equipmentChemical handlingensuring an adequate supply of consumables for rebuilding sub-assemblies. Candidate must possess good mechanical aptitude and troubleshooting abilities. Candidate must be detail oriented and able to create and follow written procedures. Candidate should have an understanding of electronic, mechanical, and vacuum systems. Strong verbal and written communication skills. Ability to interact professionally in a fast-paced production environment. Knowledge of 5S principles and experience maintaining 5S organization within maintenance or parts management environment. Job Qualifications: Minimum educational requirements are High School Diploma or Equivalent. 2-3 years of previous equipment maintenance and/or parts management is advantageous. Prefer 3 to 5 years of related wafer fab experience with an emphasis on production equipment. Microsoft Excel knowledge for data entry and tracking More information about NXP in the United States...