Process Integration Development Engineer

Job Details: Job Description: At Intel, we are at the forefront of innovation, creating world-changing technology that enriches the lives of every person on planet. The Foundry labs directly support advancement of Intel's technology development. The transmission electron microscopy group supports engineering activities in fabrication, failure analysis, technology development, process development, process integration, and pathfinding. Our job is to understand where our manufacturing process and metrologies need to be improved. We are looking for engineers who love solving technical problems, are driven to achieve results, and are flexible in adapting to new methods, tools, and fields of study depending on what is needed to solve the problem at hand. The position will involve daily focus ion beam(FIB) lamella preparation and advanced transmission electron microscopy (TEM) characterization on semiconduction nanostructures using TEM imaging, electron diffraction, strain analysis, EDS and EELS. The Time-To-Information-Return (TTIR) of this imaging analysis is critical to TD as we advance process nodes and require revolutionary changes in our support structure and methodologies. We are embarking on those changes. The Engineer will be responsible for but not limited to: o Technical functions in support of engineering activities such as fabrication, failure analysis, technology development, process development, and process integration. o Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues.