Process Integration & Program Leader, Hybrid Bonding / 3DIC

Job Details: Job Description: About the Role Lead the integration and execution of next-generation hybrid bonding and 3DIC technologies, taking complex semiconductor technology from development through qualification, manufacturing ramp, and high-volume production. This is a highly visible technical leadership role responsible for bringing together process development, yield, manufacturing, quality, product engineering, and business teams. You will solve complex integration challenges, drive critical technology decisions, manage execution risk, and ensure successful delivery against performance, yield, reliability, schedule, and customer commitments. Responsibilities Own the process integration strategy and execution for advanced hybrid bonding and 3DIC technologies. Drive cross-module optimization across performance, yield, defectivity, reliability, quality, cost, and manufacturability. Lead resolution of complex process integration and manufacturing challenges. Drive technology maturity from development through qualification, technology transfer, manufacturing ramp, and HVM. Lead integrated execution across Process Development, Module Engineering, Yield, Manufacturing, Quality, Product Engineering, Supply Chain, and business organizations. Establish technical priorities, evaluate tradeoffs, manage risks, and drive cross-functional decisions. Partner with customers and product teams to translate requirements into technology and execution priorities. Communicate technology readiness, risks, and recommendations to senior leadership and customer stakeholders.