Senior Process Integration Engineer

Job Details: Job Description: The Role and Impact As a Process Integration Development Engineer, you will drive revolutionary advancements in substrate manufacturing technologies, ensuring smooth and efficient integration processes for next-generation packaging solutions. Your primary focus will be working closely with supplier engineering teams to develop and optimize processes, manage capacity, improve yield and enhance lead times. This role is pivotal to Intel's ability to deliver cutting-edge solutions to meet growing customer demand on EMIB-T advanced packaging solutions. Business group The role resides within Intel Corporation's Substrate Packaging Technology Development (SPTD) Dept and in the Substrate Integration Asia group, which focuses on advancing substrate packaging technologies to enable innovative solutions for heterogeneous chip architectures. The group collaborates with global teams and suppliers to deliver scalable manufacturing processes, supporting Intel's broader goals of technology leadership and innovation in advanced packaging. Key Responsibilities • Engage with supplier engineering teams and Intel's US integration group to advance substrate technologies and manage critical process interactions. • Monitor, optimize, and enhance bottleneck processes to reduce throughput time (TPT) and improve efficiencies. • Oversee schedules for product and test vehicle (TV) deliveries, resolving issues to meet aggressive on-time delivery (OTD) goals. • Analyze substrate lead times, develop reduction roadmaps, and ensure quarterly lead time targets are met.