Senior Signal Integrity Engineer – LPU Packaging

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. We have built an incredible legacy of innovation fueled by great technology and amazing people. Today, we are tapping into the unlimited potential of AI to define the next era of computing. As an NVIDIAN, you will be immersed in a diverse, supportive environment where everyone is inspired to do their life’s work. Come join the team and see how you can make a lasting impact on the world. NVIDIA is now looking for a Senior Signal Integrity Engineer to join our Packaging and Systems team! In this role, you will drive high-speed SerDes channel design, simulation, and correlation for next-generation advanced packages and data center platforms. You will work across silicon, package, board, and system boundaries to develop robust high-speed interconnect solutions for demanding HPC and AI applications, where signal integrity is critical to performance, scale, and reliability! What you’ll be doing Lead signal integrity design and analysis for high-speed SerDes channels across die, package, board, connector, socket, and cable interfaces Develop and execute simulation flows for advanced packaging technologies, including 2.5D, 3D, and multi-die integration, with strong focus on channel loss, discontinuities, return path behavior, and crosstalk Build and optimize chip-package-board co-simulation methodologies for next-generation HPC and data center systems Drive SI modeling and design optimization for package escapes, vias, breakouts, interposers, substrates, sockets, and other…