Signal/Power Integrity Engineer (On-/Off-Chip)

RESPONSIBILITIES - Define SI/PI requirements based on IP and system-level specifications. - Perform SI/PI simulations at electromagnetic (EM), circuit, and system levels. - Develop SI/PI methodologies for advanced packaging technologies such as chiplet, 3D-IC, D2D (die-to-die), and C2C (chip-to-chip) interfaces. - Cover SI/PI analysis and optimization at the full system level, including on-chip, package, and PCB domains. - Provide design guidance on stack-up, interconnect routing, PDN architecture, decoupling strategy, and component selection. - Collaborate with silicon, package, and board teams to ensure accurate measurement-simulation correlation and system-level robustness. - Support debug and bring-up efforts in the lab when needed. - Work with internal teams and partners to co-optimize SI/PI solutions. MINIMUM QUALIFICATIONS - BS or MS in Electrical Engineering, Physics, or a related field. - 8+ years of experience in component- and system-level SI/PI analysis. - Solid understanding of SI/PI fundamentals and methodologies. - Hands-on experience with lab instruments such as VNA, TDR, and real-time oscilloscopes. - Proficient in EDA tools such as SIwave, HFSS, ADS, HSPICE, Allegro, RedHwak-SC, SC-ET, or RedHawk-3DIC. PREFERRED QUALIFICATIONS - PhD in Electrical Engineering, Physics, or a related field with 5+ years of relevant industry experience.