Sr. Staff High-Speed Communication Architect – AI Systems

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. We are seeking an exceptional Senior Staff or Principal High-Speed Communication Architect to define the next generation of high-bandwidth communication architecture for rack-scale AI accelerator systems. This role owns the end-to-end communication path between AI chips, GPUs, CPUs, switches, memory systems, and network interfaces, spanning 224G+ electrical links, flyover cables, near-package and co-packaged optics, and rack-scale fabrics. You will make system-level tradeoffs across architecture, ASIC and package design, PCB, connectors and cables, signal integrity, optical technology, and rack mechanics. This role is hybrid, based out of North America. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.