STAFF ENGINEER, TDT PD DRY ETCH

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Dry Etch Process Development Engineer in Technology Development Taiwan (TDT), you will develop the plasma etch processes for Micron's next-generation DRAM and carry them from development into high-volume manufacturing across Boise and the Taiwan fabs. You will own critical etch steps end to end — recipe development, process control, technology transfer and yield improvement — working with Process Integration, Yield/FA, the fabs and equipment suppliers. What you will do · Develop and optimize critical DRAM dry etch steps (e.g. STI, SAC, contact/HARC, gate, patterning) to meet CD, profile, selectivity, uniformity and electrical targets. · Lead technology transfer and ramp: qualify new processes, tools and materials, set the POR baseline, and enable it at the receiving fab on schedule. · Reduce variation: drive within-wafer uniformity, chamber matching and inline variation reduction using SPC, FDC and R2R/APC. · Lead root cause on yield, defect and excursion issues with PI and Yield using Model-Based Problem Solving (MBPS): characterize first, then prove the mechanism with DOE, CD-SEM/XSEM/TEM and probe correlation. · Drive process maturity (PMI) for your steps: raise capability (Cpk), close POR/MOR gaps and build tool redundancy to reach each PMI level on schedule.