Advanced Packaging Cryogenic Modeling Engineer
Apply on Globalfoundries’s site →About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com . Summary of Role: GlobalFoundries is seeking an experienced thermal, mechanical, and/or electrical modeler/engineer with demonstrated cryogenic modeling experience to support cryogenic packaging and system co-optimization R&D. The engineer will leverage commercial multi - physics tools to build, correlate, and apply models that capture low-temperature material property behavior and thermo-mechanical effects (e.g., thermal contraction and CTE mismatch) to guide device, integration, and cryogenic 3DHI advanced packaging optimizations for mechanical, thermal, and/or electrical performance. Essential Responsibilities: Demonstrated experience using commercial software to develop and correlate cryogenic thermal, mechanical, and/or electrical models for semiconductor devices and advanced packages (e.g., 77 K and below), including temperature-dependent material properties and boundary conditions. Stress simulations for continuous and discontinuous active areas, and how stress affects device performance if the skill is mechanical modeling.