Advanced Packaging jobs
47 open roles. Median advertised base $145,000 across 17 postings that publish a range.
Substrates Material Engineer NEW
Intel · Virtual China · 2026-11-09
no range
Sr. Packaging Engineer - Thermal Materials, AI Satellites (Starmind)
SpaceX · Bastrop, TX · 2026-11-06
no range
Sr. Thermal Engineer - Fluids Analysis, AI Satellites (Starmind)
SpaceX · Bastrop, TX · 2026-11-06
no range
Sr. Thermal Engineer - Spacecraft Analysis, AI Satellites (Starmind)
SpaceX · Bastrop, TX · 2026-11-06
no range
Sr. Thermal Engineer (Starlink)
SpaceX · Bastrop, TX · 2026-11-06
no range
Sr. Thermal Engineer, Thermal & Fluid Analysis (Starship)
SpaceX · Hawthorne, CA · 2026-11-06
$130,000–$180,000
Thermal Engineer, AI Satellites (Starmind)
SpaceX · Bastrop, TX · 2026-11-06
no range
Thermal Engineer (Falcon, Dragon, & Starfall)
SpaceX · Hawthorne, CA · 2026-11-06
$100,000+
Thermal Engineer, Satellites (Starlink)
SpaceX · Redmond, WA · 2026-11-06
$100,000+
Thermal Engineer (Starlink)
SpaceX · Bastrop, TX · 2026-11-06
no range
Thermal Engineer (Starshield)
SpaceX · Hawthorne, CA · 2026-11-06
$100,000+
Thermal Engineer, Thermal & Fluid Analysis (Starship)
SpaceX · Starbase, TX · 2026-11-06
no range
New Mexico Wafer Packaging Manufacturing Advanced Packaging Die Pick Engineering Group Leader
Intel · US, New Mexico, Albuquerque · 2026-11-06
$120,860+
Senior Integration Lead - Advanced Packaging 3DHi and 2.5D
Globalfoundries · Singapore · 2026-11-06
no range
Principal Wet Process Engineer, Advanced Packaging
Micron · Boise, ID - Main Site · 2026-11-05
no range
Senior Optical Packaging Engineer
PsiQuantum · Milpitas, California · 2026-11-04
$160,000+
MTS - Advanced Packaging 2.5D and Deep Trench Integration Engineer
Globalfoundries · Singapore · 2026-11-03
no range
Senior Thermal Engineer
Astranis · San Francisco · 2026-11-03
$145,000+
Thermal Engineer
Astranis · San Francisco · 2026-11-03
$130,000+
Intern - Process Integration – Advanced Packaging
Micron · Boise, ID - Main Site · 2026-10-31
no range
Advanced Packaging Technology & Integration Leader
Amat · Santa Clara,CA · 2026-10-29
$200,000+
3D Packaging Engineer
QuantWare · Delft · 2026-10-27
no range
Senior Thermal Engineer
Muon Space · San Jose, CA · 2026-10-25
$173,000–$193,000
Thermal Engineer II
Muon Space · San Jose, CA · 2026-10-25
$153,000–$172,000
Thermal Engineering Intern (Summer 2027)
Muon Space · San Jose, CA · 2026-10-25
no range
Engineer, APTD CEM - Advanced Packaging Equipment Engineering
Micron · Fab 10A, Singapore · 2026-10-24
no range
Engineer, APTD CEM - Advanced Packaging Integration Engineering
Micron · Fab 10A, Singapore · 2026-10-24
no range
Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
Micron · Fab 10A, Singapore · 2026-10-24
no range
Staff/Principal Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
Micron · Fab 10A, Singapore · 2026-10-24
no range
Staff/Principal Engineer, APTD CEM - Advanced Packaging Integration Engineering
Micron · Fab 10A, Singapore · 2026-10-24
no range
Advanced Packaging Lead
QuantWare · Delft · 2026-10-23
no range
Senior Substrate Engineer
Intel · Taiwan, Taipei · 2026-10-21
no range
Substrate Supply Commodity Manager
Intel · Malaysia, Penang · 2026-10-21
no range
Thermal Engineer, Rack Level
Etched · San Jose · 2026-10-20
$200,000–$350,000
Director, Advanced Packaging Technology Development
Micron · Taichung - Fab 16, Taiwan · 2026-10-19
no range
Staff Engineer, Advanced Packaging Development - Design Enablement & Layout
Micron · Boise, ID - Main Site · 2026-10-16
no range
Senior Engineer, Advanced Packaging — Fail-Mode Metric Reaction (FMR)
Micron · Boise, ID - Main Site · 2026-10-16
no range
Supplier Management: Substrate
Intel · Taiwan, Taipei · 2026-10-09
no range
Senior Hardware Product Packaging Engineer
Skydio · San Mateo, California, United States · 2026-10-09
$153,000–$243,000
Advanced Packaging Module Development Engineer
Intel · US, Oregon, Hillsboro · 2026-09-25
$133,800+
Advanced Packaging Substrate Supplier Enablement Lead
Intel · US, Arizona, Phoenix · 2026-09-22
$164,100+
Substrate IC Package Layout Design Engineer (Taiwan)
Etched · Taipei · 2026-09-17
no range
Advanced Packaging SI/PI Engineer
Etched · San Jose · 2026-08-27
no range
Substrate IC Package Layout Design Engineer
Etched · San Jose · 2026-08-27
no range
EMIB-T Substrate Yield Lead
Intel · US, Arizona, Phoenix · 2026-08-17
$180,770+
Advanced Packaging Cryogenic Modeling Engineer
Globalfoundries · Essex Junction · 2026-05-12
$118,000+
Thermal Engineer
Aeva · Bangalore · 2025-04-02
no range