Advanced Packaging Development Engineer

Job Details: Job Description: The Role and Impact As a Packaging Module Development Engineer, you will drive the design and optimization of innovative packaging processes and equipment essential to Intel's next-generation semiconductor technologies. Your day-to-day responsibilities will include developing solutions to enhance reliability, manufacturability, and performance in high-volume manufacturing environments. These contributions will play a critical role in advancing Intel's leadership in semiconductor packaging technologies. Business Group This role is part of Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) organization, which focuses on developing and scaling cutting-edge semiconductor packaging solutions. APTM supports Intel's broader mission by delivering technologies that empower high-performance, edge, and mobile computing applications, enabling global customer success and technological leadership. Key Responsibilities Develop, optimize, and qualify packaging assembly processes, materials, and equipment to meet quality, reliability, yield, and cost targets. Drive experimental design using methodologies such as Statistical Process Control (SPC) and Design of Experiments (DOE). Innovate new techniques, materials, and tools to address emerging challenges in packaging reliability and manufacturability. Collaborate with cross-functional teams to mitigate technical risks and ensure product development success. Establish process specifications and material requirements while working with suppliers to meet stringent quality standards.