Advanced Packaging Integration and Simulation Intern

Job Details: Job Description: Intel Technology Research is advancing the future of AI and high-performance computing through innovative advanced packaging technologies and 3D heterogeneous integration. Enabling novel system architecture, developing innovating process integration and establishing predictive physics-based simulation capabilities are critical for enabling complex large form factor packages with high-bandwidth interconnect. As an Advanced Packaging Integration and Simulation Intern, you will collaborate with leading researchers, process engineers, and modeling experts to develop and assess next-generation package architectures. In this role, you will contribute to advanced Research and Dev across package integration, process flow definition and development, package modeling, yield and reliability assessment, and data analytics. Key Responsibilities Support advanced packaging integration activities across wafer-level and package-level process flows, including wafer level process, 2.5D/3D integration, chiplet integration, and hybrid bonding-related modules. Develop and execute Design of Experiments (DOE) to understand relationships among package architecture, process conditions, material behavior, and electrical/mechanical performance. Build, calibrate, and apply simulation models to understand mechanical characteristics of packages, interconnect quality, thermal performance, etc. Conduct thermo-mechanical simulations to evaluate material responses to temperature, stress, and package-level loading conditions.