Advanced Packaging Metrology Engineering Manager
Apply on Intel’s site →Job Details: Job Description: Intel Corporation is a global technology leader at the forefront of semiconductor innovation, dedicated to creating world-changing technology that improves the lives of every person on the planet. Intel's Wafer-Level Assembly Technology Development (WATD) group is a dynamic, forward-thinking organization focused on developing next-generation packaging technologies. With a culture built on collaboration, inclusion, and relentless innovation, Intel offers an environment where your work truly matters — and where the future of technology is being written every day. We are seeking a visionary and technically accomplished Advanced Packaging Metrology Engineering Manager to lead a high-performing team of engineers at the cutting edge of advanced semiconductor packaging. In this pivotal role, you will drive innovation in wafer-level assembly technologies, champion manufacturing readiness, and deliver results that reinforce Intel's position as a global technology leader. You will shape the future of advanced packaging by enabling robust process pathways, executing long-term technology strategies, and cultivating a team culture rooted in excellence, accountability, and collaboration. Key Responsibilities: Lead and inspire a team of engineers to develop advanced wafer processing and packaging solutions that push the boundaries of semiconductor technology. Drive technology enablement, feasibility studies, and module improvement initiatives that align with Intel's strategic roadmap.