Advanced Packaging Modeling Engineer

We are looking for an experienced mechanical, thermal or electrical modeler / engineer to address 3DHI and advanced packaging questions for a wide range of logic, RF, analog and memory technologies. This person will focus upon the use of commercial modeling tools for guiding device, integration and 3DHI advanced packaging optimizations for mechanical, thermal or electrical performance optimizations. About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com . Summary of Role: We are looking for an experienced mechanical, thermal or electrical modeler / engineer to address 3DHI and advanced packaging questions for a wide range of logic, RF, analog and memory technologies. This person will focus upon the use of commercial modeling tools for guiding device, integration and 3DHI advanced packaging optimizations for mechanical, thermal or electrical performance optimizations. Work Location: This position is for a role in our state-of-the-art 300mm fabrication facility in Malta, New York. Essential Responsibilities: Familiarity with commercial software for mechanical or thermal or electrical modeling.