Advanced Packaging Module Development Engineer

Job Details: Job Description: Intel Corporation is one of the world's leading semiconductor companies, driving innovation that shapes the future of computing, connectivity, and human progress. With decades of pioneering research and development, Intel is at the forefront of designing and manufacturing the world's most advanced chips and technologies. Our Oregon campus in Hillsboro is one of Intel's largest and most strategically important sites globally, serving as a hub for cutting-edge semiconductor research, development, and high-volume manufacturing. At Intel, we believe in the power of human ingenuity and are committed to creating an inclusive, collaborative environment where brilliant minds come together to solve the world's most complex technological challenges. We are seeking a highly motivated and technically skilled Process Integration Engineer to join our dynamic team in Hillsboro, Oregon. In this critical role, you will be at the intersection of innovation and manufacturing, driving technology development and enablement for both high-volume manufacturing and next-generation semiconductor technologies. You will lead the design and development of sophisticated manufacturing processes, perform pathfinding activities for future device architectures, and collaborate with world-class suppliers and internal teams to push the boundaries of what's possible in semiconductor technology. This is a unique opportunity to make a meaningful impact on Intel's strategic roadmap and the broader semiconductor industry.