Advanced Packaging Process Engineer

Job Details: Job Description: Intel is one of the world's most iconic technology companies, driving innovation in semiconductors for over five decades. From the chips that power your laptop to the processors enabling artificial intelligence and autonomous vehicles, Intel's technology is woven into the fabric of modern life. Our Advanced Packaging Technology Manufacturing (APTM) organization is at the heart of Intel's next chapter — developing and commercializing the packaging technologies that will define the future of computing. We are committed to building a diverse, inclusive, and innovative workplace where every employee can do their best work and make a real difference. We are looking for a talented and driven Packaging Module Development Engineer to join our APTM team at Intel's world-class manufacturing campus in Chandler, Arizona. In this role, you will be a key contributor to the development, optimization, and qualification of advanced semiconductor packaging processes — work that directly enables Intel's products to reach billions of people around the world. Whether you're a recent PhD graduate eager to apply your research expertise or an experienced engineer ready to take on new challenges, this is an opportunity to do meaningful, high-impact work alongside some of the best engineers in the semiconductor industry. Key Responsibilities: Develop and optimize packaging assembly processes and equipment to meet stringent quality, reliability, yield, and cost targets in high-volume manufacturing environments.