Advanced Packaging SI/PI Engineer

About Etched Etched is building hardware for frontier intelligence. We co-design chips, racks, software, and manufacturing to deliver best-in-class throughput and latency across both prefill and decode workloads. Our first products are heavily focused on inference. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history. Job Summary As a Signal & Power Integrity Engineer you will be responsible for the electrical performance of our AI accelerator platform across silicon, package, and board. The ideal candidate will have extensive experience with high-power package and board designs, robust power delivery networks, and high-speed signaling solutions in advanced packaging. You will work closely with silicon, package, platform, and system teams to co-design world-class platforms with OSAT and ODM partners. Intense focus on pushing what is possible in power delivery and high-speed signaling for our silicon. Key Responsibilities - SI/PI analysis of designs and optimization within 2D/2.5D/3D packages - Close interaction with Package Layout Designers, ASIC PD and IP teams as well as Board Schematic/Layout/SI/PI teams to optimize the best electrical performance - Drive SI requirements into interposer/substrate layout (high-speed routing: 112G/224G) from preliminary design through tape-out. - Drive PDN design and decoupling strategy across substrate and interposer, owning DC IR drop, dynamic IR drop, and impedance targets across all rails.