Advanced Packaging TD Plating Module Engineer

Job Details: Job Description: The Role and Impact As a Module Development Engineer, you will play an integral role in advancing Intel's semiconductor manufacturing capabilities. Your day-to-day responsibilities will focus on developing and optimizing advanced manufacturing processes, performing feasibility studies, and enabling high-volume manufacturing solutions for next-generation device architectures. By driving process innovation and collaborating across teams, your work will directly impact Intel's ability to deliver cutting-edge products and maintain its leadership in the semiconductor industry. Business group You will be part of Intel's Advanced Packaging Technology Development organization, a pioneering team that focuses on creating robust and scalable manufacturing processes to support Intel's innovation in semiconductor technology. This group is instrumental in enabling high-volume production while driving advancements in device performance and reliability, helping Intel achieve its broader goals of technological excellence and industry leadership. Key Responsibilities Develop and optimize advanced manufacturing processes, including material selection, equipment metrology, and system design. Conduct feasibility studies and simulations to meet device performance and reliability specifications. Drive process innovation and pathfinding activities to enable next-generation semiconductor architectures. Collaborate with equipment and material suppliers to design and implement innovative process technologies.