EMIB-T Substrate Yield Lead

Job Details: Job Description: Intel's APTM organization is seeking a highly driven and execution-focused EMIB-T Substrate Yield Lead to lead yield performance for next-generation advanced packaging technologies, including EMIB-T (Embedded Multi-die Interconnect Bridge with TSV) , Intel's most advanced platform for heterogeneous integration. This is a high-visibility, high-accountability role with significant responsibility for enabling successful technology development and manufacturing readiness across both Intel Foundry Services (IFS) and Intel Product Groups (IPG) . The ideal candidate is a self-starter who thrives in ambiguous and fast-paced environments, proactively drives issues to closure, and requires minimal supervision. Success in this role requires strong technical depth, urgency in execution, the ability to influence cross-functional teams and suppliers, and a relentless focus on delivering yield and program milestones. Key Responsibilities Own end-to-end substrate yield performance for EMIB-T technology development and manufacturing readiness. Drive DFM/DFY engagement, defect pareto closure, process optimization, and yield improvement plans from signal identification through execution. Lead daily yield huddles and cross-functional reviews to ensure program execution remains on track and yield risks are identified and addressed with urgency. Proactively identify, prioritize, and drive closure of critical yield, reliability, process, and supplier-related issues with minimal management oversight.