Intern - Advanced Packaging TD

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Micron’s Advanced Packaging Technology Development (TD) team, where innovation and precision come together to develop next-generation interconnect technologies. The team develops solutions designed to improve semiconductor performance, reliability, and advanced packaging capabilities. As an Advanced Package TD Process Intern, you will collaborate with experienced engineers to support development of technologies including hybrid bonding, micro bump technology, Through-Silicon Vias (TSV), and thermal management. You will gain hands-on experience in structured problem-solving, line monitoring, data analysis, experimental design, and project management while contributing to process optimization and yield improvement. You will also leverage AI and Code Assist to develop Agent-based solutions that support engineering analysis and process development activities. Responsibilities Lead structured problem-solving activities using methodologies such as Kepner-Tregoe (KT) to address process and yield challenges. Define, complete, and analyze Design of Experiments (DoE) for advanced packaging and interconnect process development. Analyze process, line-monitoring, and yield data; develop new monitoring methods and critical metrics to support process optimization.