Intern - Process Integration – Advanced Packaging

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Introduction Micron’s Wafer Level Packaging Technologies Team is at the forefront of developing advanced interconnect and packaging solutions that enable next-generation memory technologies. Based in Boise, Idaho, the team collaborates across engineering fields to define technology requirements, build program plans, and drive innovation in process integration. Position Overview As an Advanced Package TD Process Integration Intern, you will work alongside experienced engineers to support the development of sophisticated interconnect technologies. This internship offers hands-on experience in problem-solving, experimental design, line monitoring, and data analysis, contributing directly to yield improvement and process optimization.