MTS - Advanced Packaging 2.5D and Deep Trench Integration Engineer

About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com. Summary of Role: The CMOS product team is seeking a Singapore-based Advanced Packaging 2.5D and Deep Trench Integration Engineer to join GlobalFoundries’ local technology development organization. Based at our Singapore site, this engineer will support and drive integration activities for 2.5D solutions and deep trench (DT) technologies from early process development and test-vehicle execution through qualification and manufacturing readiness. The successful candidate will bring practical experience in semiconductor process integration, with expertise in deep trench structures and relevant 2.5D technologies such as silicon interposers, through-silicon vias (TSVs), redistribution layers, wafer thinning, bonding, and package-level integration. The role will coordinate module interfaces, execute experiments, analyze electrical and physical data, resolve integration issues, and support process control, reliability, yield, and manufacturability improvements.