MTS/Principal Process Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)

About GF GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power efficient and high-performance solutions for high growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity, and sustainability. For more information, visit www.gf.com . Introduction: Globalfoundries Singapore is seeking highly skilled and motivated Experienced Member of Technical Staff (MTS)/Principal Process Engineer, to become part of our starting 300mm Advance Packaging Center, Singapore. The primary responsibilities of this position are to develop and/or optimize unit processes to set up Advance Packaging related process (bond & Debond, pre-bond - Plasma / UV / cleaning process, Die re-constitution, annealing & TSV) on multi-stack bond wafer / Die-to-Wafer process (on wafer level or frame Form Carrier level), do troubleshooting for process and tool issues. Additionally, the candidate will be expected to assist in tooling start-up, installing the processes into manufacturing, and owning the processes and the tools in manufacturing. Job Responsibilities: Designing, executing, and analyzing experiments to develop advanced packaging etch processes to meet technology (e.g. performance, yield, and reliability) and manufacturing (e.g.