New Mexico Wafer Packaging Manufacturing Advanced Packaging Die Pick Engineering Group Leader

Job Details: Job Description: The Role and Impact As a Module Engineering Manager, you will lead a team of engineers to support high-volume manufacturing processes and drive advancements within Intel's next-generation packaging technologies. You will oversee daily operations, facilitate continuous improvement initiatives, and execute engineering strategies that enhance safety, quality, and productivity. Your leadership will play a pivotal role in enabling Intel to deliver innovative, industry-leading products while fostering a collaborative and inclusive work environment. Business group Intel Corporation's Wafer Packaging Manufacturing (WPM) organization focuses on developing and sustaining advanced manufacturing processes to support Intel's high-volume production goals. This group plays a key role in enabling Intel's innovative packaging and semiconductor technologies, contributing to operational excellence, quality improvements, and cost efficiencies across Intel's global manufacturing network. Key Responsibilities Lead and manage a team of engineers to support safe, high-volume manufacturing processes while driving continuous improvements in quality, output, cost, and yield. Provide tactical direction and prioritize activities for sustaining operations, systematic troubleshooting, and process optimization. Collaborate with cross-functional engineering and manufacturing teams to address integrated process and equipment challenges. Develop and mentor engineers, cultivating technical expertise, leadership skills, and long-term growth opportunities within the team.