Ph.D. Intern - Advanced Packaging & Physical Integration

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact The AI era has fundamentally changed what a semiconductor package is. A package is no longer a container for a chip — it is the architecture. As AI accelerators push beyond the reticle limit of any single die, the package has become the integration layer where compute silicon, high-bandwidth memory, optical I/O, and die-to-die interconnects are assembled into a unified system. At Marvell, the advanced packaging team is where that integration happens — for the custom XPUs, AI accelerators, and high-speed connectivity platforms that the world's largest hyperscalers depend on to scale their AI infrastructure. Marvell's packaging work is production-qualified and shipping at hyperscale.