Principal Advanced Packaging Design Engineer

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact The Marvell Advanced Packaging team is responsible for package design and technology development to meet the electrical, mechanical, thermal, and system requirements of next-generation High-Performance Computing (HPC), Artificial Intelligence (AI), and networking solutions. The team focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, processability, manufacturability, and reliability. This work involves high-speed signaling and complex power delivery networks (PDNs) that require innovative and customized solutions to meet constantly evolving customer needs. Many of these new designs require multi-chip, multi-component configurations, including but not limited to 2.5D and 3D packages, co-packaged copper or optical solutions, and advanced substrates. Marvell has partnered with the world's leading manufacturers to solve our customers' most challenging design and integration problems through industry-leading packaging technologies.