Principal Advanced Packaging Engineer

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com . Principal Advanced Packaging Engineer: About the Role Astera Labs is seeking a Principal Advanced Packaging Engineer to lead R&D for next-generation packaging technologies for optical chips. This is a senior individual contributor role focused on setting technical direction and driving packaging technology development for NPO and CPO products. Responsibilities Lead R&D for advanced packaging of optical chips, including 2.1D, 2.5D, and 3D integration. Define and optimize wafer-level, panel-level, or die-level packaging process flows. Drive EIC-to-PIC integration and broader optical device integration efforts. Select and qualify packaging materials for advanced packaging. Partner with OSAT, tool vendors, and material suppliers to drive equipment, process, and materials development.