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Product Engineering Architect (3D IC, Heterogeneous Integration & Advanced Packaging)

CadenceSAN JOSE$185,500–$344,500Advanced Packaging
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The published floor of $185,500 is 41% above the Advanced Packaging median of $131,750. First seen on this site 2026-10-01, open 7 days.
Posted 2026-10-07 · read from workday

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. Job Title: Product Engineering Architect Location: San Jose, California, United States Reports to: Product Engineering Director Job Overview: As Product Engineering Architect, you provide senior technical leadership for the development and proliferation of Cadence Virtuoso Heterogeneous Integration technologies. In this role, you partner closely with strategic customers, Product Management, R&D, Product Validation, and Application Engineering teams to define product strategy, drive innovation, and ensure successful delivery of complex technical solutions. As an architect, you combine deep technical expertise with market understanding to shape the product roadmap for the physical implementation flows around 3D IC, heterogeneous integration and advanced packaging. You will drive team-level technical objectives throughout the development cycle and lead early customer engagements. Job Responsibilities: Drive, validate and promote an end-to-end solution for system design implementation flows spanning 3D IC, heterogeneous integration and advanced packaging. Lead strategic customer engagements, guiding customers to define and deploy advanced heterogeneous integration and multi-die co-design methodologies. Influence product roadmap direction by synthesizing customer requirements, market trends, competitive insights, and technical feasibility. Produce high-quality Product Requirement Specifications (PRS), technical use cases, and support R&D during product development.