Senior Advanced Packaging Defect Inspection Engineer

Job Details: Job Description: The Advanced Packaging Technology Development (APTD) Metrology Group at Intel sits at the heart of our most critical technology development and pathfinding programs. As packaging architectures grow increasingly complex, the role of metrology has evolved far beyond traditional inspection and measurement — it has become a strategic enabler of technology progress, yield learning, and program decision-making confidence. We are seeking a Senior Module Development Engineer who combines deep hands-on expertise in next-generation metrology equipment with a broad, current awareness of where the semiconductor metrology industry is heading. The ideal candidate brings the technical credibility to work at the equipment level and the strategic clarity to translate industry knowledge into a forward-looking roadmap that keeps our capabilities ahead of program demand. This requires genuine engagement with the global metrology landscape — staying current with advances in measurement science, emerging equipment capabilities, and evolving industry standards — and applying that knowledge with sound judgment and determine which capabilities are worth pursuing and when. This engineer will be embedded in our most advanced development and pathfinding programs from their earliest stages — ensuring that measurement strategies are defined, equipment is ready, and metrology coverage is in place before process flows are locked and before gaps can become program risks.