Senior Integration Lead - Advanced Packaging 3DHi and 2.5D

About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visitwww.gf.com. Summary of Role: The CMOS product team is seeking a Singapore-based Senior Advanced Packaging 3DHi and2.5D Integration Lead to join GlobalFoundries’ local technology development organization. Based at our Singapore site, this lead integrator will define and drive advanced packaging technology development from architecture and early process demonstration through qualification, manufacturing transfer, and production readiness. The successful candidate will bring deep, hands-on expertise in 3D heterogeneous integration (3DHi) and 2.5D solutions, including chiplet integration, silicon interposers and bridges, through-silicon vias(TSVs), die-to-wafer and wafer-to-wafer bonding, hybrid bonding, redistribution layers, and package-level integration. The role requires ownership of integration architecture, test-site and qualification-vehicle definition, module and process-flow alignment, and electrical, thermal, mechanical, reliability, yield, and manufacturability validation.