Senior Semi Packaging Engineer
Apply on Analogdevices’s site →About Analog Devices Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X . We are looking for a highly motivated Packaging Engineer who will drive IC package and power module development activities for ADI’s new and existing products. This position will be based in San Jose, CA. Job Description Advanced package platform development: drive the development and adoption of advanced IC package platforms and processes, such as embedded package and fan-out wafer-level package. IC package design: design and optimize IC packages for a wide range of ADI products, using common and advanced analog IC package platforms and assembly/bumping processes. Power module design: design and optimize power modules for performance, manufacturing, and reliability. Package design rule: define, maintain, and advance package design rules for emerging package platforms and power modules. Assembly subcontractor/OSAT management: work closely with ADI’s oversea assembly subcontractor/OSATs for new package development and other package-related engineering activities.