Senior Silicon Substrate & Packaging Manufacturing Engineer

Fractile is building silicon, systems and software which will redefine the frontier of AI: running the world’s most advanced models at radically higher speed and lower cost. We have an exceptional team across hardware and software capable of bringing about this change, and we are growing fast to meet demand and deliver our product at scale. At this level of compute density and bandwidth, manufacturing precision is a competitive weapon. Yield, ramp velocity, and supplier performance are not operational details — they determine whether we win. We are hiring a Senior Silicon Substrate & Packaging Manufacturing Engineer to own packaging manufacturing execution in Taiwan and drive our products from first silicon through high-volume production. This is a high-accountability role with direct impact on the company's trajectory. The Role You will be Fractile’s senior manufacturing authority in Taiwan for substrate and package assembly. You will: Own packaging yield and ramp performance. Lead manufacturing strategy with OSATs and substrate suppliers. Drive structured problem-solving under schedule pressure. Build scalable manufacturing discipline in a startup environment. You are not coordinating — you are deciding, driving, and delivering. What You’ll Own Manufacturing Strategy & NPI Leadership Define packaging manufacturing readiness criteria from EVT through HVM. Lead NPI builds (EVT/DVT/PVT) with clear yield and quality targets. Identify scaling risks early (process capability, warpage, cycle time, substrate constraints).