Senior Substrate Engineer
Apply on Intel’s site →Job Details: Job Description: The Role and Impact As a Process Integration Development Engineer, you will play a pivotal role in driving revolutionary advancements in substrate manufacturing technologies. You will oversee the development, optimization, and integration of cutting-edge processes to improve performance, yield, and reliability of substrates used in semiconductor packaging. Through hands-on collaboration with cross-functional teams, your work will directly contribute to Intel's leadership in innovative packaging solutions and manufacturing excellence. Business group Asia Capex Substrate Integration is part of Intel Corporation's broader effort to deliver world-class substrate packaging solutions, enabling the development of advanced semiconductor technologies. The group focuses on integrating high-performance substrate processes, driving innovation in manufacturing and packaging, and supporting Intel's mission of creating technology that powers global progress. Key Responsibilities Develop and optimize process integration methodologies for advanced substrates, ensuring high yield and product reliability. Collaborate with cross-functional teams including design, manufacturing, and quality groups to identify and address technical challenges. Evaluate and implement new materials, tools, and techniques to improve substrate performance and cost efficiency. Conduct detailed analysis to troubleshoot process issues and drive continuous improvement initiatives. Support technology transfer and ramp-up for high-volume manufacturing operations.