SMTS Integration Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)

About GlobalFoundries GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power efficient and high-performance solutions for high growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity, and sustainability. For more information, visit www.gf.com . Introduction We are seeking an experienced and highly motivated SMTS Integration Engineer to lead our Advanced Packaging Program, with a specific focus on 2.5D and 3D heterogeneous integration technologies. The ideal candidate will have extensive knowledge and hands-on experience in these advanced semiconductor packaging technologies, along with a strong background in engineering integration processes. This position offers a unique opportunity to work on cutting-edge packaging solutions that will drive the next generation of semiconductor devices. Responsibilities: Lead Integration Activities: Oversee and manage the integration of 2.5D and 3D heterogeneous integration technologies, ensuring seamless collaboration between design, process, and manufacturing teams. Technical Expertise: Provide technical guidance and expertise in 2.5D and 3D packaging processes, materials, and equipment. Stay current with industry trends and advancements.