SMTS Process Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)

About GlobalFoundries GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com . Introduction: GlobalFoundries Singapore is seeking a highly skilled and motivated Senior Member of Technical Staff (SMTS), Process Engineering, to join our new 300mm Advanced Packaging Center in Singapore. In this role, you will be responsible for developing, optimizing, and qualifying advanced packaging processes, including Bond/Debond, Plasma, UV, Cleaning, Die Reconstitution, Annealing, and Through-Silicon Via (TSV) technologies for multi-stack wafer bonding and Die-to-Wafer integration at both wafer and frame-form-carrier levels. You will drive process development, troubleshoot process and equipment-related issues, support tool installation and qualification, and lead the transfer of robust manufacturing-ready processes into production. As a key technical owner, you will oversee both process performance and equipment sustainability to ensure successful high-volume manufacturing. Job Responsibilities: Designing, executing, and analyzing experiments to develop advanced packaging etch processes to meet technology (e.g. performance, yield, and reliability) and manufacturing (e.g.