Sr Principal Packaging Engineer

This role offers the opportunity to develop industry-leading semiconductor packaging solutions for automotive and industrial applications. As a member of the New Product Development and Operations team, the Senior Principal Packaging Engineer will define the package technology roadmap, lead advanced package design and selection, optimize solutions for performance, reliability, manufacturability, and cost, and manage OSAT partners for back-end assembly and packaging. About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com . Essential Responsibilities: Design, develop, and implement packaging solutions that support business-unit product requirements and the package technology roadmap. Identify, evaluate, select package materials / BOM to meet internal quality and cost targets. Evaluate and optimize assembly flows and materials to drive package cost reduction, while improving overall efficiency of the process. Monitor packaging technology, materials, supplier capabilities, and industry best practices to benchmark competitiveness and identify opportunities for roadmap advancement.