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Silicon Roles

Sr Staff Substrate Yield Lead

IntelUS, Arizona, Phoenix$180,770+Advanced Packaging
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The published floor of $180,770 is 33% above the Advanced Packaging median of $136,150. First seen on this site 2026-10-07, open 2 days.
Posted 2026-10-06 · read from workday

Job Details: Job Description: Intel Corporation is seeking a high-impact Yield Development Engineer to drive yield performance for cutting-edge manufacturing processes within the Substrate Technology and Development (SPTD) organization. In this role, you will own end-to-end yield improvement initiatives, leveraging your expertise in data analysis, defect resolution, and designnd transform the future of technology. Intel's APTM organization is seeking a highly driven and execution-focused EMIB-T Substrate Yield Lead to lead yield performance for next-generation advanced packaging technologies, including EMIB-T (Embedded Multi-die Interconnect Bridge with TSV) , Intel's most advanced platform for heterogeneous integration. This is a high-visibility, high-accountability role with significant responsibility for enabling successful technology development and manufacturing readiness across both Intel Foundry Services (IFS) and Intel Product Groups (IPG) . The ideal candidate is a self-starter who thrives in ambiguous and fast-paced environments, proactively drives issues to closure, and requires minimal supervision. Success in this role requires strong technical depth, urgency in execution, the ability to influence cross-functional teams and suppliers, and a relentless focus on delivering yield and program milestones. Business group The SPTD Yield group is part of Intel Corporation and plays a critical role in driving innovation and delivering high-performance yield solutions that enable advanced semiconductor manufacturing.