Staff Engineer, Semi Packaging Engineering
Apply on Analogdevices’s site →About Analog Devices Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X . We are seeking an experienced Packaging Engineer to lead the development and production implementation of advanced packaging solutions for module products. The engineer will own package development from concept, design and development through qualification and production release. This role will collaborate with product design teams, material suppliers, manufacturing partners, and outsourced semiconductor assembly and test providers to deliver reliable, manufacturable, and high-performance packaging solutions. Key Responsibilities: Develop packaging solutions for new module products to optimize performance, manufacturability and reliability from initial design through qualification and production release. Develop materials, assembly processes, process control plans with material suppliers, assembly vendors during new package development (NPI). Develop new package technologies, associated assembly processes, and design rules in collaboration with the product design engineers and the suppliers.