Substrate Packaging Research and Development Engineer

Job Details: Job Description: As a Packaging Module Development Engineer, you will play a vital role in advancing Intel's semiconductor manufacturing capabilities by developing innovative packaging processes and equipment. Your day-to-day responsibilities will focus on optimizing assembly methods to achieve quality, reliability, and efficiency goals in high-volume manufacturing environments. By collaborating with cross-functional teams, you will help shape Intel's next-generation packaging technologies, directly contributing to the company's success in the semiconductor industry. Business group This position is part of Intel Corporation's Substrate Packaging Technology Development (SPTD) organization, which drives advancements in substrate packaging to support Intel's global technology leadership. The group focuses on delivering next-generation solutions for high-performance and mobile computing applications, enabling heterogeneous integration and die disaggregation across Intel's product portfolio. Key Responsibilities Develop and optimize advanced packaging processes, materials, and equipment to meet reliability, quality, and cost targets. Design and implement process specifications, workflows, and equipment configurations for new technologies. Conduct design of experiments (DOE) to characterize process windows and interactions between equipment, materials, and chemistry. Drive continuous improvement efforts to enhance process capability, stability, and productivity. Collaborate with cross-functional teams to resolve technical challenges and deliver impactful solutions.