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Silicon Roles

Substrates Business Capacity and Capability Lead

IntelUS, Arizona, Phoenix$191,220+Advanced Packaging
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The published floor of $191,220 is 40% above the Advanced Packaging median of $136,150. First seen on this site 2026-10-09.
Posted 2026-10-08 · read from workday

Job Details: Job Description: The Substrates Business Capacity and Capability Lead will lead a high-impact team of engineers with responsibility for the following enterprise-critical priorities: Set direction for supplier technical capability assessments and readiness plans to ensure execution against critical product, technology, and customer timelines. Assess the substrate supplier network's capacity, capability, scalability, and long-term readiness. Partner across Intel organizations to define supply chain requirements aligned to Intel's product and foundry roadmaps. Shape future capacity expansion plans and technical requirements required to enable next-generation products and technologies. Drive supplier capacity expansion timelines, readiness checkpoints, and executive-level risk mitigation. Maintain visibility to supplier network capacity, investment needs, and readiness for emerging technical building blocks. Evaluate supplier investment requirements and collaborate across SBG and partner organizations to establish product cost, affordability, and price targets. Build and sustain strategic engagement with in-network and out-of-network substrate, material, and equipment suppliers to maintain market intelligence, anticipate industry shifts, and advance Intel's leadership in substrate technology. Serve as a senior interface with Intel Technology Development groups and business units to align supplier capacity, capability, and technology readiness to future product requirements.