Director of SoC Implementation / Physical Design

We are seeking a highly experienced leader to head SoC Implementation / Physical Design for advanced semiconductor products. This role will own end-to-end physical design execution across complex SoCs, driving delivery from RTL to silicon for cutting-edge technology nodes. The ideal candidate combines deep technical expertise with strong organizational leadership , capable of managing large global teams and delivering high-quality silicon on aggressive schedules. Key Responsibilities 1. End-to-End Physical Design Ownership Lead complete SoC physical design execution including floorplanning, synthesis, place & route, CTS, routing, STA, PDN, PDV and signoff. Drive timing, power, IR/EM, and physical verification closure to achieve tapeout readiness. Deliver optimized PPA (Power, Performance, Area) across complex designs. Aligns with internal expectations of implementing designs on silicon with optimal quality, PPA, and cost efficiency 2. Program & Execution Leadership Own planning, tracking, and execution of physical design programs from specification through tapeout. Manage risks, dependencies, and schedules across multi-site global teams. Drive cross-functional alignment across RTL, DFT, STA, verification, and packaging teams. Ensure delivery to aggressive project timelines and quality metrics. 3. Team Leadership & Organization Development Build and lead high-performing global physical design teams. Drive hiring, mentoring, and career development across technical leads and engineers. Establish execution discipline, review mechanisms, and performance tracking.