SoC Physical Design Senior Manager, HBM

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an SoC Physical Design Senior Manager, HBM in the Heterogeneous Integration Group (HIG), you will lead a team of physical design and physical verification engineers responsible for implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tapeout. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations. Key Responsibilities Recruit, develop, and mentor a team of physical design engineers delivering HBM base die products. Plan project resourcing requirements and timelines. Prioritize resources across projects and individual assignments to meet aggressive product delivery schedules. Drive physical implementation for SoC blocks and/or top-level including floorplanning, placement, CTS, routing, and physical optimization to meet PPA targets. Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs.