Sr Engineer, Advanced Packaging Design Enablement Engineering (APDEE)

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Are you ready to be part of a world-class team driving innovation at the intersection of silicon development and advanced packaging? We are seeking an exceptionally skilled and ambitious Sr Engineer for our Advanced Packaging Build Enablement Engineering (APDEE) team, located in Hyderabad, Telangana, India. This role is pivotal in accomplishing a flawless build strategy for High Bandwidth Memory (HBM) packaging programs. Advanced Packaging Technology Development org is seeking an experienced and technically strong Semiconductor design Senior Engineer to support High Bandwidth Memory (HBM) packaging program. This role sits at the critical intersection of silicon design and advanced packaging, responsible for executing advanced packaging related design strategy that enables world-class HBM product integration.